The production of semiconductor procurement high efficiency optical windowcomponents on silicon wafers has long been a goal of the electronics industry, but it has proven to be challenging. Now, researchers at the A*STAR Institute have developed a new manufacturing method that is cheap, simple, and scalable.
Hybrid silicon optics combine the luminescent properties of III-V semiconductors such as gallium arsenide and indium phosphide with proven silicon fabrication techniques. These optical components have attracted considerable attention because they can integrate photonic and microelectronic components into a single silicon chip, resulting in inexpensive, mass-produced optics. They have broad application prospects, from short-range data communication to high-speed, long-distance customizable Anti-Reflection (AR) Coated optical window transmission.
However, in the current production process, optical components are fabricated on separate III-V semiconductor wafers and then individually aligned to each silicon device – a time consuming and expensive process that limits the optics on the chip. Quantity. To overcome these limitations, DorisKeh-TingNg from the A*STAR Data Storage Institute and colleagues have developed an innovative method for producing hybrid micro-cavities for mixed III-V semiconductors and silicon-on-insulator (SOI) films. This greatly reduces the complexity of the manufacturing process and makes the device structure more compact.
Oblique-angle scanning electron microscope image of a 500 nm diameter microdisk. Image courtesy of A*STAR Data Storage Institute
“It is very challenging to etch the entire cavity,” Ng said. “Currently, there is no single etching recipe and mask that allows etching throughout the microcavity, so we decided to develop a new method.”
By first attaching the III-V semiconductor film to a silicon oxide (SiO2) wafer using an SOI interlayer thermal bonding process, they create a strong bond, eliminating the need for an oxidant such as a piranha etchant or hydrofluoric acid. . Moreover, by using a dual hard mask technique to etch into the microcavities of the desired layer, they eliminate the need to use multiple overlay lithography and etch cycles – a challenging process procurement high efficiency optical lens parts.
Ng explained: “Our approach reduces the number of manufacturing steps, reduces the use of hazardous chemicals, and the entire process requires only one lithography step to complete.”
For the first time, this work introduces a new heterogeneous core configuration and integrated fabrication process that combines low temperature SiO2 interlayer bonding with a dual hard mask, single lithography pattern.
Ng said: “This process not only creates heterogeneous nuclear devices, but also greatly reduces the difficulty of the manufacturing process, and can be used as another hybrid microcavity in the research field.”